| 摘要 |
PURPOSE:To provide an alignment method capable of maintaining high alignment precision. CONSTITUTION:The position of a first table 2 in the X-axis and the Y-axis directions are measured with laser interferometers 9a, 9b, and a driving part 8 is driven. The first table 2 is moved until a desired position and stopped. Each positioning mark 6 of a wafer 1 is irradiated with the laser light from position deviation detectors 15a, 15b, 15c, through each positioning mark 7 of a reticle 4. The interference light is received, and the relative position deviation of the first table 2 and a second table 5 is measured. By driving a driving part 13, the second table 5 is moved, and the positional deviation of the positioning marks 6, 7 is corrected. The driving system of thetaZ-axis direction of the second table 5 is restrained, and the driving part 13 is driven on the basis of measurement data from the positional deviation detectors 15a, 15b, 15c. Thereby the second table 5 is moved only in the directions of X and Y, and the relative positional deviation from the first table 2 in the X-axis and the Y-axis directions is corrected. |
