| 摘要 |
PURPOSE:To manufacture a semiconductor cleaning device, which is small in size and is superior in throughput capacity, by a method wherein the wafer hand of a transfer part directly holds each wafer extracted from product cassettes and the wafers are made to transfer in order to a cleaning part, a water washing part and a drying part. CONSTITUTION:A plurality of wafers 1 are respectively held by a wafer hand 35a of a cleaning product transfer part 35, are sent form a product insertion/ extraction part 31A to a cleaning part 32A and a cleaning of the wafers is performed. After that, the wafers 1 are respectively delivered from the cleaning part 32A to a wafer receiver of a water washing part 33A by the hand 35a, and are washed in water. After that, the wafers 1 are sent from the water washing part 33A to a drying part 34A and are dried. After that, the transfer part 35 moves the wafers 1 from the drying part 34A to the part 31A by the hand 35a and inserts the wafers 1 in product cassettes 4 placed on a support stage 31a. In such a way, by conducting the cleaning, the water washing and the drying of the wafers without using cassettes for cleaning, a cleaning device can be manufactured in a small size.
|
