| 摘要 |
<p>PURPOSE: To obtain an external contact of standardized arrangement by sequentially forming a first ceramic passivation layer, a non-corrosive conductive layer and a second ceramic passivation layer on a surface of a circuit sub-assembly having the contact. CONSTITUTION: The hermetically sealed integrated circuit comprises a circuit sub-assembly having an external contact 2, a first ceramic passivation layer 3 on a surface of the sub-assembly having an opening 5 for the contact 2, and a non-corrosive conductive layer 4 covering parts of the contact 2 and layer 3. Further, the circuit comprises a second ceramic passivation layer 6 covering parts of the layer 4 and the layer 3 not covered with the layer 4. An opening 7 reaching the layer 4 via the second layer 6 is formed to realize external contact at the standardized arrangement to constitute a hermetically sealed integrated circuit having standardized arrangement of the contact.</p> |
