| 摘要 |
PURPOSE:To provide a high-reliability multilayer circuit board, concerning to a manufacturing method for multilayer circuit boards suitable for high-speed propagation. CONSTITUTION:Concerning to a manufacturing method for a multilayer circuit board composed by forming a conductor wiring layers 1 out of conductors and an insulating layer 3 out of resin material on a board 20 successively, a process of forming the insulating layer 3 on the surface of a board 20 is contained in the manufacture, by bringing gaseous raw materials alpha and beta having resin materials capable of low-temperature film forming as main components into contact with the board 20 and making them grow. |
