| 摘要 |
PURPOSE:To protect a conductor part subjected to high current or high voltage and a soldered part against crack while reducing production cost. CONSTITUTION:In the printed board, a metal plate 13 having a predetermined pattern is fixed to a board 12 having a through hole 22 for passing the lead wire 19 of an electronic component. A hole 16 for passing the lead wire 19 and soldering is made through the metal plate 13 and the dimension of the insertion hole 22 is set larger than that of the connection hole 16. When the lead wire 19 is inserted into the connection hole 16 and soldered, upper and lower solder fillets 24, 25 are formed on the metal plate 13 around the connection hole 16 and thereby the strength and reliability are enhanced sufficiently at the soldered part.
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