| 摘要 |
<p>PCT No. PCT/EP94/00747 Sec. 371 Date Sep. 14, 1995 Sec. 102(e) Date Sep. 14, 1995 PCT Filed Mar. 10, 1994 PCT Pub. No. WO94/21703 PCT Pub. Date Sep. 29, 1994Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per molecule and (B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, and an aromatic polyamine as the hardener.</p> |
| 申请人 |
SIEMENS AG, 80333 MUENCHEN, DE;HOECHST AG, 65929 FRANKFURT, DE |
发明人 |
GENTZKOW, WOLFGANG VON, DIPL.-CHEM. DR., 8524 KLEINSENDELBACH, DE;HUBER, JUERGEN, 8520 ERLANGEN, DE;KAPITZA, HEINRICH, DIPL.-CHEM. DR., 8510 FUERTH, DE;ROGLER, WOLFGANG, DIPL.-CHEM. DR., 8521 MOEHRENDORF, DE;WILHELM, DIETER, DIPL.-CHEM. DR., 8550 FORCHHEIM, DE;KLEINER, HANS-JERG, DIPL.-CHEM. DR., 6242 KRONBERG, DE |
