Acid anhydride-containing one package epoxy resin composition.

摘要

An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a latent curing accelerator soluble in an epoxy resin having two or more epoxy groups in one molecule and (c) a latent curing accelerator soluble in an acid anhydride and (4) a dispersible latent curing accelerator, in which the ratio of (1) to (2) is from 0.8 to 1.2 as (the number of acid anhydride equivalent)/(the number of epoxy equivalent) and the amounts of (3) and (4) each are from 0.1 to 10 parts by weight to 100 parts by weight of the epoxy resin. The composition has excellent infiltrability, storage stability and reactivity.