发明名称 APPARATUS FOR AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER.
摘要 <p>When an ingot is sliced into wafers, they are given serial numbers for identification. This makes possible to identify which any wafer being processed is of those sliced from the ingot no matter where the wafer is in a manufacturing process. Each wafer is traced so as to determine the path along which the wafer was transferred during the manufacturing process, and results are stored as wafer information. <IMAGE></p>
申请公布号 EP0616364(A1) 申请公布日期 1994.09.21
申请号 EP19920922598 申请日期 1992.10.29
申请人 KOMATSU ELECTRONIC METALS CO., LTD 发明人 IWAKIRI, EIJI, KOMATSU ELECTRONIC METALS CO., LTD.;FUKUSHIMA, SHINGO;TAKITANI, YUKITAKA, KABUSHIKI KAISHA KOMATSU
分类号 H01L21/02;H01L21/00;H01L21/673;H01L21/677;H01L23/544;(IPC1-7):H01L21/68;H01L21/66 主分类号 H01L21/02
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