发明名称 |
Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material. |
摘要 |
<p>The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material.</p> |
申请公布号 |
EP0279769(B1) |
申请公布日期 |
1994.09.21 |
申请号 |
EP19880630026 |
申请日期 |
1988.02.17 |
申请人 |
ROGERS CORPORATION |
发明人 |
ARTHUR, DAVID J.;MOSKO, JOHN C.;JACKSON, CONNIE S.;TRAUT, ROBERT G. |
分类号 |
C08K3/00;B32B15/08;B32B15/082;C08K9/06;C08L27/12;C09D127/12;H01B3/44;H01L23/08;H01L23/14;H05K1/03;H05K1/05;H05K3/38;H05K3/46;(IPC1-7):H05K1/03;H01B3/12 |
主分类号 |
C08K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|