| 摘要 |
PURPOSE:To realize a method for manufacturing glass and ceramic multilayer interconnection boards with a high yield, capable of shortening binder removing processing time by burning an organic binder containing in green sheets efficiently, and capable of making it difficult for cracks to be produced around via hole conductors. CONSTITUTION:A green sheet laminated is burned in a nonoxidizing atmosphere in a first burning process, in order to make the strength of a ceramic body higher maintaining its porosity of 10% or more. Following this, an organic binder contained in the laminate is removed in an oxidizing atmosphere in a second burning process, and burning is performed so as to make the quantity of residual carbon 200ppm or less. Following this, burning is performed in a reducing atmosphere in a third burning process, and a conductor circuit oxidized is reduced. Finally, sintering is performed in a nonoxidizing atmosphere in a fourth burning process, and the ceramic body is made fine. Concerning to the burning temperatures, the burning temperature in the fourth burning process is higher than the softening point of glass, and lower than the melting point of conductors exceptionally. But the burning temperatures in other burning processes are lower than the softening point of glass and in a range of the softening point and a temperature 100-200 deg.C lower than that. |
