Multilayered wiring board with wiring configurations to reduce crosstalk

摘要

This multilayered wiring board having a multilayered wiring structure includes a first mesh wiring layer having a plurality of holes therein, and a second wiring layer having a plurality of wirings. The wirings of the second wiring layer undulate up and down so as to descend towards the holes formed in the first wiring layer. In another arrangement, the first wiring layer has a plurality of protrusions protruding toward the second wiring layer at locations between adjacent ones of the wirings of the second wiring layer. In these wiring boards, crosstalk between the wirings is suppressed.