| 摘要 |
PURPOSE:To improve available percentage by providing the fixing parts of headers and lead frames not in between the adjacent IC's outside the resin sealed regions but in the resin sealed regions. CONSTITUTION:IC pellets are connected to the IC pellet connecting parts 7 of the plural heads 4 of a header 1, the caulking projections 6 of the header 1 are inserted into the corresponding caulking perforations 15 of a lead frame 9, and the header 1 and the lead frame 9 are fixed by caulking. The tip of each inner lead 12 and each corresponding electrode of the IC pellets are connected via wire and are resin sealed. After sealed, the unnecessary parts of the lead frame 9 and the header 1, i.e., dams 17, a lengthwise frame 10 and crosswise frames 13 are cut away to separate individual IC's. |
