| 摘要 |
Electroless deposition-catalyzing film-forming solutions comprising polyamic acid and noble metal, e.g. palladium complexed with ammonia, in an aprotic solvent, e.g. N-methyl-2-pyrrolidone with a surfactant. Such solutions are used to provide articles having a coating or patterned image of a electrolessly-depositable element such as copper, nickel and the like on high heat resistant substrates, e.g. metals, ceramics, glass, silicon, high heat polymers and thermoset polymers. In the methods of this invention a polyamic acid/noble metal solution is applied as a coating or patterned image to provide a coherent polyamic acid film which can be imidized, e.g. by heat treatment at 250 DEG C. or higher, providing a tough, adhesive polyimide film that can catalyze electroless deposition.
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