发明名称 Grounding spring clip for modular jacks
摘要 A grounding spring clip for modular jacks includes a stamped or etched plate having an opening substantially coextensive with the plug receiving opening in a modular jack and a bent tab to provide at least one springy finger extending out from the plate adjacent the opening and partially occluding the opening. Two opposite edges of the plate are bent backward to provide curls which wrap around corresponding edges of the face plate of a snap-in modular jack. One edge of the plate is bent to provide a tab stop and the edge opposite the tab stop is left straight. The grounding spring clip is slid onto the face plate of a snap-in modular jack before the jack is mounted in a chassis panel. When the jack is snapped into the chassis panel, the curled edges of the spring clip are biased between the face plate of the jack and the surface of the chassis panel thereby making a good electrical connection with the chassis. When a shielded modular plug is inserted into the jack, the springy finger adjacent the opening in the spring clip engages the outer sheath of the plug thereby making a good electrical connection with the shielding of the shielded cable carrying the plug. The integrity of the coupling is easily visually inspected and the spring clip can be quickly and inexpensively replaced if necessary.
申请公布号 US5348484(A) 申请公布日期 1994.09.20
申请号 US19930078582 申请日期 1993.06.17
申请人 GENERAL DATACOMM, INC. 发明人 SORRENTINO, GREGORY L.
分类号 H01R4/64;H01R13/658;(IPC1-7):H01R4/66 主分类号 H01R4/64
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