| 摘要 |
An IC socket comprising a plurality of partition walls disposed along an IC platform and contacts which are to be brought into pressure contact with leads of an IC package mounted on the IC platform, the contacts being inserted into corresponding slits formed between adjacent the partition walls so that the contacts are orderly arranged with respect to the leads of the IC package, a foremost end face of each of the leads of the IC package being restricted by wall surfaces of a pair of adjacent partition walls for isolating the slits so that the leads are correctly positioned.
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