| 摘要 |
PURPOSE:To provide a heat sink which can improve the service life of soldered joints by reducing the thermal deformation of the heat sink. CONSTITUTION:The substrate 2 of an electronic circuit is stuck and fixed to a heat sink 1 by a thick film formation technique. A transistor section is formed in a thick film hybrid integrated circuit in such a way that a transistor chip 3 and insulating plate 9 are stacked and a projecting section 1a is formed on the bottom of the heat sink 1, and then, a recessed section is formed in a soldered joint section. In addition, the transistor section is connected and fixed to the heat sink 1 provided with projecting section (small projections) 1b with solder 10 and the electrode 3a of the chip 3 is electrically connected to a bonding pad 4 through an Al wire 11. Therefore, the heat generated from a semiconductor chip is efficiently transferred to the heat sink 1. In addition, the thermal deformation of the heat sink 1 can be reduced and the cracking of the insulating plate 9 can be reduced. |
