| 摘要 |
PURPOSE:To accurately position an external lead of a semiconductor device on an automatic wire bonder by using an external lead, which extends from the main surface of an insulating substrate to a conductive layer on the substrate, has a different reflectivity from the substrate. CONSTITUTION:An automatic wire bonder recognizes the position of a FET 6 by detecting its edge 12 so as to determine the position of a gate electrode where wire 8 is bonded. The end 11a of the external lead 3 to the gate is detected and thus the position of the lead 3 is recognized. The reflectivity of the lead 3 is compared with that of a ceramic substrate 2. Since they have different reflectivities, the edge 11a is easily detected and it is possible to accurately determine where the wire 8 is to be connected. Therefore, precision wire bonding is carried out for FETs. |
