| 摘要 |
<p>PURPOSE:To enable security of a bonding condition and reduction of the thermal stress resulting from thermal strain to be achieved by a method wherein uniformity in temperature both in a plane direction of a bond object and in the thickness direction can be kept by irradiating the bond object from both sides with optical beams which pressurized materials transmit. CONSTITUTION:Beams conducted with an optical fiber 8 are gathered with a condenser 9. A glass receiver 7 and a glass substrate 2 transmit the beams, and a bonded face between an IC chip and the glass substrate is irradiated therewith. Further, glass is used as a receiver in contact with the IC chip, and a glass head 13 is held with a head holder 14 wherein an area capable irradiating all surface of the IC chip 1 with optical beams 10 from its upper surface exists. All the IC chip is heated with the optical beams 10 which the glass receiver 7 and the glass substrate 2 transmit and with which the bonded surface is irradiated, and the optical beams 10 which the glass head 13 transmits and with which an upper surface of the IC chip 1 is irradiated.</p> |
