| 摘要 |
PURPOSE:To shorten a ground wire and reduce the ground inductance, by forming a step-difference part in a collector pad. CONSTITUTION:A step-difference part 10a is formed in a collector pad 10 by metallizing the upper part of a step-difference formed in a dielectric board 11. When a high frequency transistor chip 1 is soldered to the lower part of the step-difference part 10a, the area of the collector pad 10 is made smaller than the conventional ones, because solder flow can be prevented. Hence the distance from a base electrode 3 to a ground conductor 12 is reduced. As a result, the length of a ground wire 9 for connecting the base electrode 3 with the ground conductor 12 can be reduced, so that the ground inductance becomes small, and high frequency characteristics of a transistor are improved. |
