| 摘要 |
PURPOSE:To enhance a solder connection structure in reliability of connection strength to a temperature cycle. CONSTITUTION:Strips of insulator 11 are so provided onto the upside of an electrode 2 on a circuit board 1 of alumina, glaze, or glass as to divide the electrode 2 into short pieces. Insulator 11 is formed of insulating material such as glass, organic material, or the like. When the solder connecting electrode 4 of a flexible board 3 is connected to the electrode 2 of the board 1 through the intermediary of a solder joint 5, the solder joint 5 is divided into short blocks by the strips of insulator 11. Stress produced due to a temperature cycle on the basis of a linear expansion coefficient difference between the board 1 and the solder joint 5 is divided into pieces for each block. By this setup, stress is hardly accumulated through the overall length of the solder joint 5, so that a solder connection structure of this constitution can be prevented from deteriorating in connection strength due to stress. |
