| 摘要 |
<p>PURPOSE:To provide a direct type heat-treating device capable of rapidly dealing with a change in the form and size of a thin plate-shaped substrate to be heat- treated at low cost. CONSTITUTION:A plurality of suction holes 6 are formed in the side of the upper main surface 24 of a second metal plate 4B and at the same time, a groove part 28 connected with those suction holes 6 is formed in the side of the lower main surface 26 of the plate 4B. Accordingly, when the plate 4B is arranged on a first metal plate 4A, an opening of the groove part 28 is stopped by the plate 4A, a lateral hole is substantially formed and by decompressing the space of the lateral hole, a substrate 10 is attracted and fixed on the plate 4B.</p> |
