发明名称 SUBSTRATE COOLING DEVICE AND METHOD THEREFOR
摘要 <p>PURPOSE:To enhance the cooling effect by a method wherein refrigerators are provided above and below a vacuum vessel for CVD processing so that both upper and lower surfaces of a substrate is evenly cooled down by isotropical diffusion when a vacuum vessel is within a low pressure region while by approaching the substrate when the pressure in the vacuum vessel exceeds a specific value. CONSTITUTION:A lower refrigerator 28 is provided on the upper end of a pedestal 27 while an upper refrigerator 29 is provided on the ceiling surface of a vacuum vessel 5. Firstly, a cooling pipe 32 of the lower refirgerator 28 and another cooling pipe 35 of a cooling block 34 are communicated with cooling water at the uppermost position (almost intermediate position between the upper refrigerator 29 and the lower refrigerator 28) while the vacuum vessel 5 evacuated at a high degree of vacuum is fed with nitrogen gas through the intermediary of a nitrogen gas feed pipe 42 so as to cool down the glass substrate 1. At this time, the nitrogen gas is diffused isotropically at low pressure region to evenly gas-cool down the upper and lower surface of the glass substrate 1 however, when the pressure in the vacuum vessel 5 is boosted, the cooling efficiency is decreased so as to decelerate the cooling rate. Finally, the glass substrate 1 is lowered at the position near the upper part of the lower refrigerator 28 so as to lead-in the nitrogen gas from another nitrogen gas feed pipe 7.</p>
申请公布号 JPH06260432(A) 申请公布日期 1994.09.16
申请号 JP19930069413 申请日期 1993.03.04
申请人 KOKUSAI ELECTRIC CO LTD 发明人 MURAMATSU FUMIO;TAKEDA TOMOHIKO;KITAJIMA SHUJI
分类号 H01L21/205;H01L21/68;H01L21/683;(IPC1-7):H01L21/205 主分类号 H01L21/205
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