| 摘要 |
<p>PURPOSE:To prevent a wafer from slipping and to dissolve the unsatisfactory state of a vacuum wafer treater due to a slip of the wafer by a method wherein wafer slip resistance grooves are provided in a prescribed wafer support part of a wafer support stage for supporting the wafer. CONSTITUTION:Slip resistance grooves 6 are provided in a wafer support part 8 which is a site, which supports a wafer 11, on a wafer support stage (a heater block) 2. If a film consisting of a TEOS or the like is formed on the rear of the wafer 11 when the wafer 11 is heated, this TEOS or the like is decomposed and gas is discharged, but as this gas can be degassed from the grooves 6, the wafer can be prevented from being brought in a state that it is levitated on the support part 8. In particular, when the grooves 6 are provided in the direction of evacuation, decomposed gas can be suitably exhausted. Positions for providing the grooves 6, the number of pieces of the grooves 6 and the depth, width and the like of the grooves 6 can be properly decided. Moreover, it is also possible that the slip resistance grooves are provided in the wafer support stage of an etching device and the wafer is prevented from slipping.</p> |
