ASSEMBLY STRUCTURE OF SEMICONDUCTOR PACKAGE AND COOLING FIN,申请号JP19930044251-传众专利搜索

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发明名称	ASSEMBLY STRUCTURE OF SEMICONDUCTOR PACKAGE AND COOLING FIN
摘要
申请公布号	JPH06260573(A)	申请公布日期	1994.09.16
申请号	JP19930044251	申请日期	1993.03.05
申请人	MITSUBISHI ELECTRIC CORP	发明人	KAMOTANI YOSHIYASU
分类号	H01L23/40;(IPC1-7):H01L23/40	主分类号	H01L23/40
代理机构		代理人
主权项
地址

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