| 摘要 |
PURPOSE:To obtain a thin film wiring circuit board provided with a connecting electrode which is capable of withstanding soldering operations repeatedly carried out for repair even if it is thin by a method wherein the connecting electrode is formed of alloy of specific first and second metal and oxides of them. CONSTITUTION:A thin film wiring circuit board is provided with a highly dense wiring circuit pattern, wherein a connecting electrode 3 where an electronic component is connected through soldering connection and mounted is provided outside. The connecting electrode 3 is composed of a first metal which is high in wettability to solder forming metal at soldering connection, easily alloyed with solder forming metal, and forms compound with solder forming metal and a second metal which is low in wettability to the first metal and solder and hardly forms compound with them. For instance, the solder connecting electrode 3 is of structure composed of a Cr film as a bonding metal 31, an Ni-W-O alloy film as a solder-diffusion preventing metal 32, and an uppermost Au film as a solder wettability improving.oxidation preventing metal 33. |
