| 摘要 |
A method of electrically connecting a tape automated bonding lead (28) to an aluminum input/outpout pad (10) of an integrated circuit includes sequentially sputtering an adhesive layer (16), a diffusion barrier layer (18) and a gold layer (20) on the input/output pad (10). The adhesive layer (16) is a metallic film having good step coverage and adhesive properties to contact the pad (10). The diffusion barrier layer (18) is formed atop the adhesive layer (16) and is sandwiched by the gold layer (20). The method employs "bumpless" techniques and the bond lead (28) is connected to the gold layer (20) by applying a combination of pressure and vibrational energy. |
