| 摘要 |
<p>A heat sink assembly (10) adapted for use with an electronic device package (24) such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base (34) of a finned heat sink (28) adapted to be received in a threaded bore (26) of an adaptor (12) which mounts onto the electronic device package (24). Desired thermal coupling is achieved by screwing down the heat sink (28) in biasing engagement with the package (24). Alternate embodiments show the heat sink (28) which has a snap on flange (20, 22) to attach the heat sink (28) to the adaptor (12) and the adaptor extending down to engage with the socket (60) in which the electronic device package (24) is installed.</p> |
