| 摘要 |
An integrated circuit package comprises a ceramic sub-package (1) a substrate (5) mounted on shoulders (4) therein, a lid (9) and connecting pins (10). The sub-package (1) and substrate carry a multiplicity of naked semi-conductor dies (2A, 2B, 2C, 6A, 6B, 6C) which are connected to one another and the subpackage (1) via wire bonds (3, 7, 8). If desired, further die-carrying substrates may be stacked within the sub-package (1) thus achieving a high packing density of semi-conductor dies in a single package. <IMAGE> |
