发明名称 Heat-resistant moistureproof film
摘要 PCT No. PCT/JP91/01417 Sec. 371 Date Jul. 29, 1992 Sec. 102(e) Date Jul. 29, 1992 PCT Filed Oct. 17, 1991 PCT Pub. No. WO92/06842 PCT Pub. Date Apr. 30, 1992.A heat-resistant moistureproof film having a first layer (A), a second layer (B) bonded to one side of the first layer, and a third layer (C) bonded to the other side of the first layer. The first layer (A) is a single or a laminate of a transparent laminated film having a base film composed of PVA having a saponification degree of not less than 99 mol % and a transparent silicon oxide thin film (SO thin film) 2 formed on at least one side thereof. The second layer (B) is a single or a laminate of a transparent plastic film other than a PVA film, having at least one layer of the plastic film with a transparent SO thin film 4 having a thickness of 100 to 5000 ANGSTROM formed on at least one side thereof, and at least one layer of a transparent heat-resistant film having the sum of the absolute values of the percentages of heat-shrinkage in the machine direction and transverse direction when heated at 150 DEG C. for 30 minutes, of not more than 1% and a light transmittance of not less than 85% by ASTM D-1003. The the third layer (C) is a heat-sealable resin layer.
申请公布号 US5346752(A) 申请公布日期 1994.09.13
申请号 US19920859702 申请日期 1992.07.29
申请人 MITSUBISHI KASEI CORPORATION 发明人 SAWADA, TSUTOMU;OHASHI, SHINICHI;YOSHIDA, SHIGENOBU
分类号 B32B27/08;B65D65/40;G02F1/13357;H05B33/04;(IPC1-7):B32B9/00;B32B7/02;B32B27/30 主分类号 B32B27/08
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