| 发明名称 |
Composite printed circuit board substrate and process for its manufacture |
| 摘要 |
Composite printed circuit board substrates having fiber reinforcement in a polymer matrix are disclosed. The fibers may be thermotropic melt processable liquid crystal polymer fibers.
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| 申请公布号 |
US5346747(A) |
申请公布日期 |
1994.09.13 |
| 申请号 |
US19920996651 |
申请日期 |
1992.12.24 |
| 申请人 |
GRANMONT, INC. |
发明人 |
VANCHO, VINCENT M.;WU, HAK H.;MA, YUTAO;JORGENSEN, ERIK L. |
| 分类号 |
B32B15/08;C08J5/04;D01F6/62;D04H3/00;D21H13/24;H05K1/03;(IPC1-7):B32B9/00 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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