| 摘要 |
According to a first embodiment of the present invention, there is provided a resin encapsulation type semiconductor device, comprising a semiconductor element and an epoxy resin composition used as an encapsulating resin, the composition containing as essential components: (a) an epoxy resin represented by formula (I) given below: <IMAGE> (I) where R1, R2, R3, and R4 are hydrogen or an alkyl group respectively, and n>/=0, (b) a phenolic resin curing agent, (c) an imidazole compound, and (d) triphenyl phosphate. In the first embodiment of the present invention, a heat resistance skeletal structure is formed by the epoxy resin (a) and the phenolic resin curing agent (b) in the epoxy resin composition after cured, leading to an improved resistance to heat and to an improved package crack resistance. Further, the combination of the imidazole compound (c) used as a curing catalyst and triphenyl phosphate (d) permits ensuring a high reliability in terms of the humidity resistance and also permits improving the resistance to the external contamination.
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