发明名称 RESIN COMPOSITION
摘要 PURPOSE:To obtain a resin composition remarkably improved in flowability in molding, solvent resistance and oil resistance without detriment to the appearance, mechanical properties and heat resistance of the molding and undergoing little change in mechanical properties and dimension due to moisture. CONSTITUTION:This resin composition is obtained by melt compounding 20-80wt.% polyphenylene ether resin, 20-80wt.% thermoplastic polyester, 2-30 pts.wt. impact modifier, 0.1-5 pts.wt. mixture of a copolymer consisting of 0-50wt.% styrene compound and 100-50wt.% 3a,beta-unsaturated dicarboxylic acid anhydride with at least one compound selected from organic peroxides having at least one carbon-carbon double and/or triple bond in the molecule, and 0-5 pts.wt. organic peroxide except those having at least one carbon-carbon double and/or triple bond in the molecule.
申请公布号 JPH06256629(A) 申请公布日期 1994.09.13
申请号 JP19930043724 申请日期 1993.03.04
申请人 MITSUBISHI GAS CHEM CO INC 发明人 OKUZONO TOSHIAKI;KANO YUICHI
分类号 C08K5/14;C08L67/00;C08L67/02;C08L71/12;(IPC1-7):C08L67/02 主分类号 C08K5/14
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