发明名称 External lead shape measurement apparatus for measuring lead shape of semiconductor package by using stereoscopic vision
摘要 A lead shape measurement apparatus includes a first perspective imaging device for photographing external leads to be measured, from an oblique direction; a second perspective imaging device for photograping external leads to be measured, from an oblique direction different from that of the first perspective imaging device and so as to include a same photographic field of vision as the first perspective device; a first measurement point determination element for determining a center point of two intersecting virtual straight lines which intersect two ridges of the external leads to be measured in an image plane by photography of the first perspective imaging device; a second measurement point determination element for setting epipolar line in the image plane by the second perspective imaging device on the basis of sight lines when a measurement sampling point of the first perspective imaging device is photographed, and for determining a center point of two intersecting virtual straight lines which intersect two ridges of the external leads to be measured in an image plane and which exists upon the epipolar line; and a coordinate obtaining element for obtaining each of a plurality of the measurement sampling points which are set for measuring a three-dimensional shape of the external leads.
申请公布号 US5347363(A) 申请公布日期 1994.09.13
申请号 US19920918064 申请日期 1992.07.24
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 YAMANAKA, KAZUYUKI
分类号 G01B11/00;G01B11/24;G01B11/245;G06T1/00;H04N7/18;H04N13/00;H05K13/08;(IPC1-7):G01B11/24 主分类号 G01B11/00
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