| 摘要 |
A method for detecting orientation of a semiconductor package (11) having a cavity (19) formed in a lower surface is described. The semiconductor package (11) is positioned in a travel path (24) of a packaging process apparatus (23). An orientation support plate (17) is provided having a protrusion (18) that is designed to fit into the cavity (19) in the semiconductor package (11). The orientation support plate (17) is moved towards the semiconductor package and the protrusion (18) fits into the cavity (19) when the semiconductor package (11) is properly oriented, and the protrusion kicks the semiconductor package (11) out of the travel path (24) when the semiconductor package (11) is mis-oriented. |
