发明名称 |
Pad arrangement for a semiconductor device |
摘要 |
A semiconductor device comprises a rectangular semiconductor chip provided with an integrated circuit, and a plurality of voltage stress examination pads formed on the semiconductor chip for applying stress examination voltage to the integrated circuit, and having the same function, wherein the voltage stress examination pads are provided on opposite sides of the semiconductor chip.
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申请公布号 |
US5347145(A) |
申请公布日期 |
1994.09.13 |
申请号 |
US19910813524 |
申请日期 |
1991.12.26 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TANAKA, HIROAKI;KOYANAGI, MASARU |
分类号 |
G01R31/26;G01R31/28;G01R31/30;G01R31/3161;H01L21/66;H01L23/485;H01L23/58;(IPC1-7):H01L23/02 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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