| 摘要 |
An interposer (preformed planar structure) is disposed between a die and a substrate (which may be another die). Through holes in the interposer facilitate controlled formation of reflow solder joints between conductive bumps on the die and corresponding conductive bumps of the substrate. In one embodiment, conductive elements embedded in the preformed planar structures extend at least partially into the through holes, forming electrical connections with the corresponding solder joints. The conductive elements can be used to electrically connect one solder joint to another within the interposer, and/or may extend beyond an edge of the interposer to provide for electrical probing of or connection to the solder joints. In one embodiment, the conductive elements are extended outside of the preformed planar structure to form "pins" or leads of the flip-chip structure. In another embodiment, a foil is disposed across a through hole, so that otherwise electro-galvanically incompatible solder balls on the die and the substrate will not corrode each other.
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