发明名称 PROCESS FOR MAKING HYBRID MICROCIRCUITS PROVIDING ACCURATE THICK FILM RESISTOR PRINTING
摘要 A PROCESS FOR MAKING HYBRID MICBOCIRCUITS PROVIDING ACCURATE THICK FILM RESISTOR PRINTING An improved process for fabricating thick film hybrid microcircuits that produces thick film resistors having electrical characteristics consistent with the microcircuit design tolerances, in areas proximate a dielectric build-up. The process includes, establishing by printing and firing a plurality of first conductor traces including the cross-under conductors to a substrate. Next, the resistive elements are printed and fired on the substrate and a dielectric glaze printed and fired over the resistive elements. At least one dielectric layer is then printed and fired over the cross-under conductors. A plurality of second conductor traces are next printed and fired on the substrate, including the cross-over conductors which are printed over the dielectric layer. Finally, a dielectric glaze is printed and fired over the cross-over conductors. 12
申请公布号 CA2015772(C) 申请公布日期 1994.09.13
申请号 CA19902015772 申请日期 1990.04.30
申请人 AG COMMUNICATION SYSTEMS CORPORATION 发明人 KEATON, WILLIAM R.
分类号 H01L21/48;H05K1/03;H05K1/09;H05K1/16;H05K3/46;(IPC1-7):H05K3/12 主分类号 H01L21/48
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