| 摘要 |
PURPOSE:To automate the probing process of a probe card by a method wherein the probing process is automated according to the variety change of wafers. CONSTITUTION:A loaded dummy wafer 12 mounted on a chuck 7 is shifted to the position below a probe card 6 after detecting the central position of dummy wafer 12 by a detecting mechanism such as a height senser 35 etc. in an alignment part 3. In this position, the dummy wafer 12 is brought into contact with the edge of probe card 6 through the intermediary of a Z-up mechanism to be probed. Next, the dummy wafer 12 is shifted again to the alignment part 3 so that the reference data and probing data may be comparatively controlled by a CPU 13 to perform the X-Y axis correction and theta correction of probe card 6. The dummy card 12 is repeatedly shifted to the position below the probe card 16 to be probed. Through those procedures, the X-Y positions and parallilism of the probe of probe card 6 are confirmed. Finally, a wafer 16 to be measured is loaded on the chuck 7 to correct X, Y, theta so that a pad on the wafer may be automatically brought into contact with the probe of probe card 6 to perform probing process. |
