发明名称 |
JUSHIHIFUKUBONDEINGUSAISEN |
摘要 |
A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the wire is characterized as having a tensile strength exceeded when the wire is further elongated in length in a range of 0.5% to 3.5% of its original length by breaking of the wire during tension testing. It has been determined that an insulated bonding fine wire exhibiting such relatively low ductility produces a loop profile maintainable in a stable condition during a bonding operation while providing reliable bonding strength. |
申请公布号 |
JPH0671022(B2) |
申请公布日期 |
1994.09.07 |
申请号 |
JP19900074151 |
申请日期 |
1990.03.23 |
申请人 |
SHINNIPPON SEITETSU KK;NIPPON TEKISASU INSUTSURUMENTSU KK |
发明人 |
TATSUMI KOHEI;KONDO HIROYUKI;SUZUKI RYOICHI;BANDO TOORU;KADOGUCHI SOICHI |
分类号 |
H01L21/60;H01L23/49 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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