Integrated transmission line structure.

摘要

The integrated transmission line structure comprises a substrate (1) having alternating grooves (12) and projections (11). Transmission lines (2) are formed on the projections, and may also be formed in the grooves. Due to separating adjacent transmission lines by a distance (A) greater than the horizontal distance (B) between them, cross-talk characteristics of the transmission lines are improved. The substrate can be engaged with an encapsulating substrate (3), having a shape complementary to that of the substrate and provided with a conductor layer, so as to further improve the shielding between adjacent transmission lines. The structure can be incorporated with a chip carrier or multi-chip module.