| 摘要 |
<p>PURPOSE:To reduce cost and improve reliability by forming a small metal segment having a specified shape, from planar or linear metal material by press working method, and bonding the small metal segment on a metal lead or an electrode on a substrate. CONSTITUTION:Firstly, a metal lead 6 of a TAB film 5 is arranged on a heating stage 4. A press working jig is positioned in the manner in which a punch axis coincides with the tip part of a metal lead 6. Said jig is provided with a punch 1 and a die 2 wherein metal material 3 of a ribbon type is sent. Specified pressure is applied in the arrow A direction to the punch 1. It is made to descend and punches out metal material 3, thereby forming a small metal segment. The punch 1 is continuously made to descend, and the small metal segment is bonded with pressure on the metal lead 6, thereby forming a metal protrusion 8 of the metal lead 6. When the press jig is removed, a process forming one metal protrusion 8 is completed. Small segments of Au are bonded with pressure on the leads of a TAB in order, and the metal protrusions corresponding with a series of Al electrodes of a semiconductor element can be formed.</p> |
