| 发明名称 |
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium |
| 摘要 |
Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.
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| 申请公布号 |
US5344607(A) |
申请公布日期 |
1994.09.06 |
| 申请号 |
US19930078677 |
申请日期 |
1993.06.16 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GONYA, STEPHEN G.;LAKE, JAMES K.;LONG, RANDY C.;WILD, ROGER N. |
| 分类号 |
B23K35/26;C22C13/00;H05K3/34;(IPC1-7):C22C13/00 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 地址 |
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