EPOXY COMPOUNDS AND EPOXY RESIN COMPOSITIONS CONTAINING THE SAME

摘要

Disclosed is a novel epoxy compound of the chemical structure: <IMG> (A) (wherein n is the number of recurring units and has a value in the range of from 0 to 30, R1 and R2 are independently selected from the group consisting of hydrogen and alkyl radicals having 1 to 6 carbon atoms, R3 is an alkyl radical having 1 to 6 carbon atoms, and R4 is a tertiary alkyl radical). Also disclosed is an epoxy resin composition comprising the epoxy compound, a curing agent and a curing accelerator. The composition cures into a product having a low dielectric constant and may be used for example as an electrical insulating material, an adhesive or a coating composition.