发明名称 Solder-bearing lead
摘要 PCT No. PCT/US91/02489 Sec. 371 Date Sep. 21, 1992 Sec. 102(e) Date Sep. 21, 1992 PCT Filed Apr. 11, 1991 PCT Pub. No. WO91/16736 PCT Pub. Date Oct. 31, 1991.A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder- bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on the opposed faces of said solderbearing portion. A region of the middle portion is twisted so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surfacemounted lead for a substrate.
申请公布号 US5344343(A) 申请公布日期 1994.09.06
申请号 US19920927415 申请日期 1992.09.21
申请人 NORTH AMERICAN SPECIALTIES CORPORATION 发明人 SEIDLER, JACK
分类号 H01R4/02;H05K3/34;H05K3/40;(IPC1-7):H01R4/02;H01R9/09 主分类号 H01R4/02
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