发明名称 MULTILAYERED PRINTED WIRING BOARD AND ITS MANUFACTURE
摘要 PURPOSE:To form a plated layer of high reliability to thermal shock in a through-hole part of a multilayered printed wiring board. CONSTITUTION:In the cross-section of a through-hole part of a multilayered printed wiring board, ends of respective layers 2-4 which constitute the wiring board form unevenness and are overlaid with smoothing copper plated layers 1. Because of a high coefficient of thermal expansion, thickening the plating of an adhesive layer 2 susceptable to cracks of a plated layer improves reliability to thermal shock.
申请公布号 JPH06244550(A) 申请公布日期 1994.09.02
申请号 JP19930053037 申请日期 1993.02.17
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SUGIYAMA HIROYASU
分类号 H05K1/18;H05K3/42;H05K3/46;(IPC1-7):H05K3/42 主分类号 H05K1/18
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