发明名称 |
MULTILAYERED PRINTED WIRING BOARD AND ITS MANUFACTURE |
摘要 |
PURPOSE:To form a plated layer of high reliability to thermal shock in a through-hole part of a multilayered printed wiring board. CONSTITUTION:In the cross-section of a through-hole part of a multilayered printed wiring board, ends of respective layers 2-4 which constitute the wiring board form unevenness and are overlaid with smoothing copper plated layers 1. Because of a high coefficient of thermal expansion, thickening the plating of an adhesive layer 2 susceptable to cracks of a plated layer improves reliability to thermal shock. |
申请公布号 |
JPH06244550(A) |
申请公布日期 |
1994.09.02 |
申请号 |
JP19930053037 |
申请日期 |
1993.02.17 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
SUGIYAMA HIROYASU |
分类号 |
H05K1/18;H05K3/42;H05K3/46;(IPC1-7):H05K3/42 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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