摘要 |
PURPOSE:To form a highly reliable wiring structure having a wiring layer containing Al with high coverage. CONSTITUTION:In the title wiring structure formed on a substrate 1 and has a metallic wiring layer 7 containing Al, a Ti layer 21, TiON layer 22, and TiN layer 23 are successively formed from the substrate 1 side and a metallic wiring layer 7 containing Al is formed on the TiN layer 23.
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