发明名称 WIRING STRUCTURE AND ITS MANUFACTURE
摘要 PURPOSE:To form a highly reliable wiring structure having a wiring layer containing Al with high coverage. CONSTITUTION:In the title wiring structure formed on a substrate 1 and has a metallic wiring layer 7 containing Al, a Ti layer 21, TiON layer 22, and TiN layer 23 are successively formed from the substrate 1 side and a metallic wiring layer 7 containing Al is formed on the TiN layer 23.
申请公布号 JPH06244185(A) 申请公布日期 1994.09.02
申请号 JP19930025581 申请日期 1993.02.15
申请人 SONY CORP 发明人 ITO MASAHIKO
分类号 H01L21/28;H01L21/3205;H01L21/768;H01L23/52;H01L23/522;(IPC1-7):H01L21/320;H01L21/90 主分类号 H01L21/28
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