| 摘要 |
PURPOSE:To enable the wire bonding step using a solder wire to be performed easily and without fail in ball to ball wire bonding mode by a method wherein an upward flow of an inert gas or an oxidation-reducing gas is formed in a capillary tool part. CONSTITUTION:A capillary tool 22 with a solder wire 21 inserted therein is arranged above a work such as a lead frame 10, etc., and then an upward flow 15a of an inert gas or an oxidation-reducing gas is formed in the tool 22 part. Next, the ball part 21a on the lower end of the wire 21 is bonded onto the first bonding part of the work 10. Next, the protruded part of the wire 21 from the lower end of the tool 22 is melted down by approaching to a heat melting means 24 so as to form another ball part 21b on the end of the melted down wire piece 21. Finally, after forming the ball part 21a on the lower end of the wire 21, the ball part 21b is to be bonded onto the second bonding part. |
