| 摘要 |
PURPOSE:To include a substrate height detecting function in the mounting head side to integrate them in a body, make possible detecting the height of substrate surface in the electronic parts mounting position for each electronic parts, and reduce the damage to the electronic parts at the time of mounting to a minimum. CONSTITUTION:A camera 15 and a mounting head 10 having a suction nozzle 11 for sucking a chip parts 40 are integrated in a body. A mark M of a substrate position where the chip 40 is mounted is sensed by the camera 15, and the distance between the camera 15 and the substrate surface is measured. |
