ELECTRONIC PARTS MOUNTING EQUIPMENT

摘要

PURPOSE:To improve productivity by eliminating a coating process of adhesive agent for the electronic parts mounting position on a printed board. CONSTITUTION:A first nozzle part 6 and a second nozzle part 7 are installed in a head part 5. The first nozzle part 6 has an adhesive agent coating equipment 10 for coating an electronic parts with adhesive agent, and a suction nozzle 8 for sucking an electronic parts 4, and can independently elevate. A means for positioning the adhesive agent coating equipment 10 is installed below the first nozzle part 6 in a ascending position or the second nozzle part 7. The electronic parts 4 is coated with adhesive agent alternately by the first nozzle part 6 and the second nozzle part 7. Thereby the electronic parts 4 is mounted on the printed board 1.