| 摘要 |
PURPOSE: To reduce mutual connection inductance by fixing plural parallel metal pieces formed on the surface of a patterned electric insulator, a frame, a cap, package leads, and a package with a sealing material as a whole. CONSTITUTION: An electric insulating material 13 is fixed to a heat sink 11 and has a 1st surface 15 and a 2nd surface. A metallic layer on the 1st surface 15 has metallic regions 26, 27, 28, and 29 which consist of electrically separated metal pieces. The metallic regions of a Kelvin contact 31 form low-resistance interconnections of power transistor dies 17 and protection diodes 18. Then package leads 22 in the semiconductor package extend through a cap, to form external connection points and are held overall with a sealing material. Thus, unwanted wire interconnections are eliminated, so as to minimize inductance. |
